PALLADIUM PLATING SERVICES
ProPlate’s dedicated new product development team supports new medical device projects from concept through commericialization through our proven process roadmap.
ProPlate® has a library of solutions for a wide range of parts and industries. We are always pleased to take on new challenging projects to expand our Palladium Plating Services.
Palladium
…is a soft and rare metal known for its silvery-blue yet lustrous appearance. It also has a low melting point and density and does not oxidize at room temperature. Palladium is well suited to plating applications where the prevention of an oxide formation is required. It is a suitable substitute for Gold plating, providing a functional alternative at a much lower price.
ProPlate® has capabilities for Palladium electroplating for your plating requirements on both small and large parts, in various sized barrels and racks, and custom and prototype metal finishing.
Specifications
MIL-P-45209, ASTM B679
The Melting Point of Palladium is 2,830 degrees Fahrenheit. Palladium plating has been used to plate over ceramic insulators in various connector applications.
The Knoop hardness of Palladium can be as high as 400, compared with Cobalt hardened Type 2 Gold, which has a maximum Knoop hardness of 200. For electrical contact applications where there are point contact or sliding contact concerns, Palladium plating services are the ideal choice. Rhodium should be considered for extremely high wear conditions.
Gold is more expensive per troy ounce than Palladium. Although Palladium is a white metal and different in color than yellow Gold, it is an excellent substitute for Gold in most general electronics applications.
As Palladium has excellent solderability characteristics, the standard soldering procedures used for Gold can also be used for soldering Palladium.
Anti-diffusion & Multi-layer Plating
Palladium plating should be considered in a multi-plating process. When Copper is used as the base layer in electroplating under Gold plating, it can diffuse through the Gold electrodeposit and begin to partially oxide on the surface of the electrodeposited part. However, if a layer of Nickel or Palladium is used between Copper and Gold, the Copper will not diffuse through this intermediate layer.
Nickel is lower in cost than Palladium and so is generally suggested for use for anti-diffusion. However, whereas nickel is a magnetic metal and Palladium is not, the latter is used as the anti-diffusion layer where non-magnetic performance is required. It can also replace Gold in other non-magnetic, non-oxidizing applications.
