Palladium-Nickel Plating Services
ProPlate® provides Type II palladium-nickel plating services for electrical contacts, connectors, and high-reliability industrial components requiring wear resistance, corrosion resistance, and stable electrical performance.
Palladium-Nickel (Pd-Ni):
ProPlate® provides palladium-nickel plating services for a wide range of industrial, medical, aerospace, semiconductor, and electronics applications. Palladium-nickel is one of the most widely specified metal alloy finishes for high-reliability electrical connectors and contacts, offering a cost-effective alternative to gold while maintaining excellent wear resistance, corrosion resistance, and stable electrical performance. ProPlate plates both barrel and rack using Type II composition (80% palladium, 20% nickel) to ASTM B867.
Palladium-Nickel Plating Applications
When nickel is combined with palladium, the resulting alloy provides excellent stress and heat resistance, corrosion resistance, electrical conductivity, ductility, and solderability. Pd-Ni has become the dominant palladium-based plating for high-reliability connectors and contacts across multiple industries. Its combination of hardness, wear resistance, corrosion resistance, and cost efficiency compared to gold makes it well suited for high-cycle, high-wear contact applications. It can also be used in combination with a thin gold overplate to further enhance durability, fretting resistance, and contact performance.
Electrical Connectors and Contacts
Pd-Ni is widely specified for electrical connector pins, sockets, contacts, springs, and switches in telecommunications, aerospace, defense, semiconductor, and electronics applications. Alloying palladium with nickel significantly improves thermal stability, enabling connectors to maintain contact integrity at temperatures up to 150°C. Pd-Ni with a thin gold flash overplate is the standard system for high-mating-cycle connectors, combining Pd-Ni’s durability with improved contact resistance and wear resistance.
Aerospace and Defense
Pd-Ni plating is used for avionics connectors, mil-spec electrical contacts, and other aerospace components requiring reliable electrical performance under extreme temperature, vibration, and environmental conditions. Its enhanced corrosion resistance in saline and acidic environments makes it particularly suited for aerospace applications.
Semiconductor and Electronics
In semiconductor and electronics manufacturing, Pd-Ni is used on lead frames, IC package contacts, printed circuit board edge connectors, and other components where gold’s cost is prohibitive but gold’s performance characteristics are required. Pd-Ni provides a stable, low-resistance contact surface that resists oxidation and maintains performance over high insertion cycle counts.
Energy Technology
Pd-Ni plating is specified for electrical contacts and connectors in energy technology applications including power generation, transmission equipment, and instrumentation where reliable electrical performance and corrosion resistance are required in demanding operating environments.
As a Nickel Alternative in Medical Applications
In medical device applications where nickel cannot be used due to biocompatibility constraints or substrate compatibility requirements, palladium-nickel serves as an alternative barrier layer. It does not distort magnetic resonance images, making Pd-Ni plated components compatible with MRI environments.
Have questions about palladium-nickel plating for your application?
Palladium-Nickel Properties
Palladium-nickel alloy plating provides smooth, uniform coverage over complex geometries and fine features, resulting in a dense and consistent deposited layer. The use of defined alloy classes and thickness grades establishes a standard nomenclature, enabling clear, repeatable specifications that can be tailored to meet specific performance and application requirements.
Because palladium-nickel alloys offer a balance of hardness, wear resistance, corrosion resistance, and stable electrical performance, they are well suited for demanding functional applications. Controlled thickness grades ensure the coating delivers predictable durability and reliability while supporting consistent quality across high-volume and precision-driven production environments.
| Palladium - Pd | |||
|---|---|---|---|
| Atomic Number | 46 | Thermal Conductivity - W/(m*K) | 71 |
| Atomic Weight - g/mole | 106.42 | Electrical Resistivity - (Ohm*m) | 1.00E-07 |
| Density - g/cm³ | 12 | Electrical Conductivity - (S/m) | 1.00E-07 |
| Melting Point - C° | 1554.9 | Hardness - Hv | 461 |
| Melting Point - F° | 2830.82 | Specific Heat Capacity - J/(kg*K) | 240 |
| Nickel - Ni | |||
|---|---|---|---|
| Atomic Number | 28 | Thermal Conductivity - W/(m*K) | 91 |
| Atomic Weight - g/mole | 58.69 | Electrical Resistivity - (Ohm*m) | 6.99E-08 |
| Density - g/cm³ | 8.91 | Electrical Conductivity - (S/m) | 1.70E-07 |
| Melting Point - C° | 1453 | Hardness - Hv | 638 |
| Melting Point - F° | 2651 | Specific Heat Capacity - J/(kg*K) | 445 |
Palladium-Nickel Plating Specifications
ProPlate provides services per the certified ASTM B867. Company specific specifications can also be provided if requested.
ProPlate currently offers Type II, 80% Palladium, 20% Nickel, plating services
Palladium-Nickel Plating to ASTM B867
4.1: Orders for articles to be plated in accordance with this specification shall specify the coating system, indicating the basis metal, the thicknesses of the underplatings, the type and thickness class of the palladium-nickel coating, and the grade of the gold overplating according to Table 1, Table 2, and Table 3.
Table 1: Composition Type
Type | Nominal Composition (Mass %) | Range (Mass% Pd) |
I | 75% Pd / 25% Ni | 70-80% Pd |
II | 80% Pd / 20% Ni | 75-85% Pd |
III | 85% Pd / 15% Ni | 80-90% Pd |
IV | 90% Pd / 10% Ni | 85-95% Pd |
Table 2: Thickness Class
- Class 0.4 – 0.4µ minimum thickness
- Class 0.5 – 0.5µ minimum thickness
- Class 0.7 – 0.7µ minimum thickness
- Class 1.0 – 1.0µ minimum thickness
- Class 1.3 – 1.3µ minimum thickness
- Class 1.5 – 1.5µ minimum thickness
- Class 2.0 – 2.0µ minimum thickness
- Class 2.5 – 2.5µ minimum thickness
- Class 3.0 – 3.0µ minimum thickness
7.1: Nature of Coating – The palladium-nickel deposit shall have a minimum purity of 70% palladium
7.2: Composition – The composition of the palladium-nickel electrodeposit shall be within +/- 5% of the specified type
7.4: Thickness – Everywhere on the significant surface, the thickness of the palladium-nickel coating shall be equal to or exceed the specified thickness. The maximum thickness, however shall not exceed the drawing tolerance
Nickel Underplate
There are several reasons to utilize a Nickel under-layer before plating Pd-Ni, and even most other precious metals. Nickel base layers and intermediate layers provide a diffusion barrier to prevent the migration of Copper (as a base substrate, for example) from diffusing through the top layer of Pd-Ni.
Another practical application of Nickel as an under-layer is to use it over a rough or porous base substrate to serve as a leveling layer which facilitates a smoother surface and will help mitigate risks associated with the potential porosity of the Palladium-Nickel top layer.
In a porous base material with a thin Pd-Ni plating deposit, a Nickel underplate layer before the Pd-Ni topcoat will form passive oxides in the open air at the base of pores. Provided the environment does not contain significant levels of strong acids such as SO2 or HCl, Nickel base layers can work as a corrosion inhibitor for porous base substrates and plating deposits.
Gold Overplate
A thin Gold over-plate is beneficial to enhance the performance of the Palladium-Nickel surface using two types of Gold. Type I gold is used in the critical areas with a thickness range of 0.05-0.12 microns. Type II gold is used in critical areas with a thickness of 0.05-0.25 microns. Gold plating over a Palladium-Nickel alloy deposit adds durability, enhanced mating forces, fretting resistance, enhanced corrosion resistance, improved solder-ability & join-ability, higher electrical conductivity, and thermal stability.
Palladium-Nickel has a higher coefficient of friction than Gold. An over-plate of Gold with the proper thickness reduces friction and enhances durability. The Gold over-plate provides low shear strength that reduces friction wear. Type I Gold plating should be used at a thickness of no more than 0.12 microns to maintain a low coefficient of friction. Pd-Ni should not be mated against itself in a sliding contact pair when wear resistance and durability to fretting are desired.
Our robust metallizing processes are thoroughly designed and maintained to ensure the highest quality standards. Medical Device Quality System: ISO 13485:2016 Certified
Related Resources
Electroplated Palladium-Nickel Alloy — Medical Coating Solutions — Case study on Pd-Ni plating for medical device applications
Palladium vs. Palladium-Nickel Alloys in Plating for Electronics — ProPlate blog post
Using Palladium Plating to Enhance Electrical Contacts in Aerospace — ProPlate blog post
Palladium Plating Services — Pure palladium plating alternative
Frequently Asked Questions About Palladium-Nickel Plating Services
What is palladium-nickel plating and what are its main benefits?
Palladium-nickel plating is an electrodeposited precious metal alloy finish combining palladium’s corrosion resistance and electrical conductivity with nickel’s hardness and wear resistance. The resulting alloy provides excellent stress and heat resistance, corrosion resistance, electrical conductivity, ductility, and solderability. It is widely used as a cost-effective alternative to gold for high-reliability electrical contacts and connectors.
What composition does ProPlate offer for palladium-nickel plating?
ProPlate offers Type II palladium-nickel plating, composed of 80% palladium and 20% nickel, to ASTM B867 specification. This is the most widely specified Pd-Ni composition for industrial and electronics applications.
What specifications does ProPlate plate palladium-nickel to?
ProPlate provides palladium-nickel plating services to ASTM B867. Available thickness classes range from 0.4µ through 3.0µ minimum thickness. Company-specific specifications can also be accommodated upon request.
What industries use palladium-nickel plating?
Palladium-nickel plating is widely used in aerospace and defense, semiconductor and electronics, telecommunications, and energy technology industries. It is the dominant palladium-based finish for high-reliability electrical connectors and contacts in telecom jacks, aerospace avionics, automotive connectors, and high-speed data connectors.
Does palladium-nickel need a gold overplate?
A thin gold overplate is recommended for most connector applications. Gold plating over a palladium-nickel deposit adds durability, fretting resistance, enhanced corrosion resistance, improved solderability, higher electrical conductivity, and thermal stability. Type I gold (0.05-0.12µ) is used where maintaining a low coefficient of friction is critical. Type II gold (0.05-0.25µ) is used in critical areas requiring additional protection.
Why is a nickel underplate used with palladium-nickel plating?
A nickel underplate serves several functions before a Pd-Ni topcoat. It acts as a diffusion barrier preventing base metal ions (such as copper) from migrating through the Pd-Ni layer. It also serves as a leveling layer over rough or porous substrates, providing a smoother surface for the Pd-Ni deposit. Additionally, nickel can function as a corrosion inhibitor for porous substrates in environments not containing significant levels of strong acids.
Is palladium-nickel MRI compatible?
Palladium-nickel does not distort magnetic resonance images, making it suitable for components used in or around MRI environments. In medical applications where nickel cannot be used as a barrier layer due to biocompatibility constraints, palladium-nickel can serve as an alternative barrier layer beneath precious metal finishes.