Electroless Nickel plating - Electroless Nickel Per Mil-C-26074

(Medium & High Phosphorus Content)

Professional Plating provides both mid-phos and high-phos electroless nickel plating (EN). Electroless systems are applied to the surface of base metals by a chemical reaction mechanism that does not require electrical current. The benefit of this process is that electrical flux density fields do not govern metal deposition thickness. Flux fields tend to be non-uniform and therefore can result in non-uniform thickness of the electrodeposits. Electroless systems have superior hole filling and leveling characteristics, which make them ideal as a first layer for almost all other electroplated, finishes. Depending of thickness and phosphorous content, electroless nickel plating is an excellent corrosion inhibitor. High-phos electroless nickel plating system specifications were developed by the NATO as a result of their experience with aggressive corrosion conditions. Electroless nickel plating systems have hardness and internal stress levels at the mid-range of all nickel systems and therefore should be specified carefully when subsequent part deformation or flexure will occur.

Sulfamate Nickel Plating

Sulfamate nickel provides the lowest hardness, lowest internal stress and highest ductility of all the nickel plating systems. The finish is dull; this is an engineering finish and not a decorative finish. Sulfamate nickel has excellent solderability good corrosion resistance. The high ductility of sulfamate nickel makes this product an excellent candidate for applications where part flexure or deformation, such as crimping, will occur.